Nanotron Technologies NANOPAN5375V1 Communication and Real Time Location Systems in 2.4 GHz ISM Band User Manual UserMan FCC Exhibit 12

Nanotron Technologies GmbH Communication and Real Time Location Systems in 2.4 GHz ISM Band UserMan FCC Exhibit 12

UserMan

FCC Required Exhibit 12 nanoPAN 5375 RF Module User Manual (UserMan)Version 1.0NA-09-0256-0008-1.0FCC ID: SIFNANOPAN5375V1
Document InformationnanoPAN 5375 RF Module User Manual (UserMan)Page ii NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.Document InformationDocument Title: nanoPAN 5375 RF Module User Manual (UserMan)Document Version: 1.0Published (yyyy-mm-dd): 2009-03-18 Current Printing: 2009-3-18, 11:52 amDocument ID: NA-09-0256-0008-1.0Document Status: ReleasedDisclaimerNanotron Technologies GmbH believes the information contained herein is correct and accurate at the time of release. Nanotron Technologies GmbH reserves the right to make changes without further notice to the product to improve reliability, function or design. Nanotron Technologies GmbH does not assume any liability or responsibility arising out of this product, as well as any application or circuits described herein, neither does it convey any license under its patent rights.As far as possible, significant changes to product specifications and functionality will be provided in product specific Errata sheets, or in new versions of this document. Customers are encouraged to check the Nanotron website for the most recent updates on products.TrademarksnanoNET© is a registered trademark of Nanotron Technologies GmbH. All other trademarks, registered trademarks, and product names are the sole property of their respective owners. This document and the information contained herein is the subject of copyright and intellectual property rights under international convention. All rights reserved. No part of this document may be reproduced, stored in a retrieval system, or transmitted in any form by any means, electronic, mechanical or optical, in whole or in part, without the prior written permission of Nanotron Technologies GmbH.Copyright © 2009 Nanotron Technologies GmbH. Life Support PolicyThese products are not designed for use in life support appli-ances, devices, or systems where malfunction of these prod-ucts can reasonably be expected to result in personal injury. Nanotron Technologies GmbH customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nanotron Technologies GmbH for any damages resulting from such improper use or sale.Electromagnetic Interference / CompatibilityNearly every electronic device is susceptible to electromag-netic interference (EMI) if inadequately shielded, designed, or otherwise configured for electromagnetic compatibility. To avoid electromagnetic interference and/or compatibility conflicts, do not use this device in any facility where posted notices instruct you to do so. In aircraft, use of any radio fre-quency devices must be in accordance with applicable regula-tions. Hospitals or health care facilities may be using equipment that is sensitive to external RF energy. With medical devices, maintain a minimum separation of 15 cm (6 inches) between pacemakers and wireless devices and some wireless radios may interfere with some hearing aids. If other personal medical devices are being used in the vicinity of wireless devices, ensure that the device has been ade-quately shielded from RF energy. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.CAUTION! Electrostatic Sensitive Device. Pre-caution should be used when handling the device in order to prevent permanent damage.FCC User InformationStatement according to FCC part 15.19:This device complies with Part 15 of the FCC Rules. Opera-tion is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Statement according to FCC part 15.21:Modifications not expressly approved by this company could void the user's authority to operate the equipment.RF exposure mobil:The internal / external antennas used for this mobile transmit-ter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in con-junction with any other antenna or transmitter.”Statement according to FCC part 15.105:This equipment has been tested and found to comply with the limits for a Class A and Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a resi-dential installation and against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions as provided in the user manual, may cause harmful interference to radio communications. How-ever, there is no guarantee that interference will not occur in a particular installation. Operation of this equipment in a resi-dential area is likely to cause harmful interference in which case the user will be required to correct the interference at his or her own expense.If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to connected.• Consult the dealer or an experienced technician for help.
Table of ContentsnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1Table of Contents1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1 Key Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.1 General / DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33.2 RF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.3 Offset Clock Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.3.1 Nominal Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.4 Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.1 Overview – Icc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.2 Power Down Pad / Power Down Full . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64.3 Pout as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.4 Icc as a Function of Pout (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.5 Icc as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Module Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95.1 Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95.2 Pin Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116.1 Recommended Temperature Profile for Lead Free Reflow Soldering . . . . . . . . . . . . . . . . . . . . . 116.2 Footprint and Recommended Landing Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 nanoPAN 5375 RF Test Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158.2 PCB Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
List of Tables nanoPAN 5375 RF Module User Manual (UserMan)Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.Intentionally Left Blank
OverviewnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 111 Overview The nanoPAN 5375 Module integrates all the required components for a complete RF modulebased on Nanotron’s innovative nanoLOC TRX Transceiver. At only 29 mm by 15 mm and lessthan 4 mm thick, this RF module includes a balun, a band pass filter, a set of clock crystals, a 20dBm power amplifier, as well as the nanoLOC chip and required circuitry. Figure 1 below shows thenanoPAN 5375 RF Module with a shielding cap and label.Figure 1: nanoPAN 5375 RF Module – top showing shielding capFigure 2 below shows the pad side of the nanoPAN 5375 RF Module with pins 1 and 32 indicated,as well as dimensions.Figure 2: nanoPAN 5375 RF Module – pad side1.1 Key ComponentsFigure 3 below shows the key components of the nanoPAN 5375 RF Module.Figure 3: nanoPAN 5375 RF Module – key componentsScale 3:1Pin 1Pin 32Scale 3:1 29.0 mm15.0 mm32 MHz crystalBand pass filternanoLOC chip32 kHz crystal BalunScale 3:1RF SwitchPower amplifier
OverviewnanoPAN 5375 RF Module User Manual (UserMan)Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.1Table 1: Key componentsComponent DescriptionnanoLOC TRX TransceiverThe nanoLOC chip supports a freely adjustable center frequency with two sets of 3 non-overlapping frequency channels, as well as 14 overlapping frequency channels, all within the 2.4 GHz ISM band. These channels provide support for multiple physi-cally independent networks and improved coexistence performance with existing 2.4 GHz wireless technologies. Data rates are selectable from 2 Mbps to 250 kbps.Due to the chip’s unique chirp pulse, adjustment of the antenna is not critical. This sig-nificantly simplifies the system’s installation and maintenance (“pick and place”).A sophisticated MAC controller with CSMA/CA and TDMA support is included, as is Forward Error Correction (FEC) and 128 bit hardware encryption. To minimize soft-ware and microcontroller requirements, the nanoLOC chip also provides scrambling, automatic address matching, and packet retransmission.Integrated into the nanoLOC chip is a Digital Dispersive Delay Line (DDDL). This is responsible for distinguishing between two possible incoming signals generated by another nanoLOC chip. These are either an Upchirp or a Downchirp, both of which have the same center frequency and the same bandwidth. The difference between an Upchirp and a Downchirp occurs only in the phase information of the complex spec-trum. This phase information is enough for the DDDL to compress a pulse at one out-put port and expand it at the other (that is, to extend the incoming signal to the doubled duration). In this way the DDDL acts like a matched filter for one of the possible trans-mitted pulses.Matching circuits (Balun)At the RF interface of the nanoLOC chip, a differential impedance of 200 Ω exists which is matched to the asymmetrical 50 Ω impedance of the antenna port by a 200 Ω to 50 Ω RF balun. Additional external components at the RF interface have a power and noise matching function that allows a sharing of the antenna without an external TX/RX – RF switch.ISM band pass filterFor an improved robustness against out-of-band inferences, an ISM band pass filter is connected at the antenna port.32.768 kHz and 32 MHz quartz crystalsThe 32.768 kHz quartz is used for the Real Time Clock oscillator. The 32 MHz quartz works with the internal oscillator circuitry of the nanoLOC chip.RF switch This switch is actually two devices that are used to switch the RX / TX paths between receive and transmit mode. Power amplifier This amplifier gives the module high efficiency, high gain, and a high output power of 20 dBm.
Absolute Maximum RatingsnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 322 Absolute Maximum RatingsNote: It is critical that the ratings provided in Absolute Maximum Ratings be carefully observed. Stress exceeding one or more of these limiting values may cause permanent damage to the nanoPAN 5375 RF Module.3 Electrical Characteristics3.1 General / DC ParametersNote 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.Note 2: Not tested in production. Only by characterization.Note 3: RX off, TX off, Baseband Clock on.Note 4: RX off, TX off, Baseband Clock off.Table 2: Absolute maximum ratingParameter Value UnitMin. operating temperature -40.0 °CMax. operating temperature +85.0 °CMax. supply voltage (Vcc)2.7 VMax. DC current per I/O pin 2.0 mATable 3: General / DC-ParametersNote Symbol Parameter Condition Min. Typ. Max. Units–Top Operating temperature –-40.0 –+85.0 °C–Vcc Supply voltage –2.3 –2.7 V2Icc Supply current TX Low power TX Reg 0x00 75.0 mA2Icc Supply current TX Mid power TX Reg 0x1F 80.0 mA2Icc Supply current TX Full power TX Reg 0xx3F –210.0 –mA1Icc Supply current RX Unsync (80/1/1) 51.0 mA1Icc Supply current RX Sync (80/1/1) 46.0 mA2Icc Supply current Ready (3) 4.0 mA2Icc Supply current StandBy (4) 2.5 mA2Icc Supply current Power Up 750.0 uA1Icc Supply current PD Pad 550.0 625.0 900.0 µA1Icc Supply current PD FULL 3.0 3.8 5.0 uA
Electrical CharacteristicsnanoPAN 5375 RF Module User Manual (UserMan)Page 4 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.33.2 RF ParametersNote 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.Note 2: Not tested in production. Only by characterization.Note 3: The displayed value is the minimum receive signal power required for BER = 10e-3, which is equivalent to the maximum receiver sensitivity3.3 Offset Clock ParametersNote 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.Table 4: RF parametersNote Symbol Parameter Condition Min. Typ. Max. Units–Zant Line impedance of antenna signal ANT – – 50.0 –Ω–Rdata Data rate –250.0 –2000 kb/s2Psens Receiver sensitivity 22/4, FECoff –-92.0 -95.0 dBm2Psens Receiver sensitivity 22/4, FECon –-95.0 -97.0 dBm1Psens Receiver sensitivity 80/1, FEC 0ff –-85 -86 dBm2Psens Receiver sensitivity 80/4, FEC 0n –-92 -94 dBm2Ptx MIN Transmit power TX Reg 0x00 –-17.5 –dBm2Ptx MID Transmit power TX Reg 0x1F –6.0 –dBm1Ptx FULL Transmit power TX Reg 0x3F 18.0 19.5 –dBm1Ptx Transmit power - 2 harmonics TX Reg 0x3F –-60.0 –dBm1Ptx Transmit power - 3 harmonics TX Reg 0x3F –-65.0 –dBmTable 5: Offset clock parametersNote Symbol Parameter Condition Min. Typ. Max. Units1f32m Offset Clock 32.000 MHz 25 °C, 2.5V 0.0 ppm1f32k Offset Clock 32.768 kHz 25 °C, 2.5V 25.0 ppm
Electrical CharacteristicsnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 533.3.1 Nominal ConditionsTable 6 below lists the nominal conditions, except otherwise noted:3.4 Digital InterfaceNote: Table 7 below lists the parameters and values for the following digital IOs:+DIIO0, DIIO1, DIIO2, DIIO3+UCRESET, UCIRQ+SPITXD, SPIRXD, SPICLK, SPISSN+/TX_RX+/PONRESETTable 6: Nominal conditions+Tjunct = 30°C+VSSA = VSSD = GND+VDDA = VCC = +2.5 V +Transmission / reception @ 250 kbps+Nominal frequency bandwidth (TX/RX)B = 22 MHz @ -30 dBr+Raw data mode+No CRC+No FEC+No encryption+Receiver synchronized+Bit scrambling+BER = 0.001 during receive mode+RF output power (PEP) during transmit phase = 20 dBm EIRP measured during continuoustransmission+Nominal process+All RF ports are impedance matched according tothe specification+All RF power are measured on the IC terminals(pins)+For link distance measurement, two identicalnanoLOC systems are usedTable 7: Digital Interface to Sensor / ActorSymbol Parameter Value Unit– Number of general purpose input/outputs 4 Number– Width of each interface 1 Bit– Direction In/Out (bi-directional, open-drain with pull-up–– Type Programmable –CIN Logic Input Capacitance 2.5 pFInput VoltageVIL Low level input voltage (minimum) 0.2 x VCC VVIH High level input voltage (maximum) 0.7 x VCC VOutput VoltageVOL Low level output voltage (maximum) 0.3 VVOH High level output voltage (minimum) VCC - 0.3 V– Maximum output current 2 mARUP Equivalent pull-up resistance (minimum)11. Can be programmed in nanoLOC TRX. Default is off. 50 kΩRUP Equivalent pull-up resistance (maximum)1193 kΩRDN Equivalent pull-down resistance (minimum)150 kΩRDN Equivalent pull-down resistance (maximum)1275 kΩ
Power ManagementnanoPAN 5375 RF Module User Manual (UserMan)Page 6 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.44 Power Management4.1 Overview – IccFigure 4: Typical Icc current drain for different operating modes 4.2 Power Down Pad / Power Down FullFigure 5: Typical Icc current drain for Power Down Pad / FullIcc / mAIcc / mA
Power ManagementnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 744.3 Pout as a Function of Tx Register (Typical) Figure 6: Power management – Pout as a function of Tx register (typical)4.4 Icc as a Function of Pout (Typical)Figure 7: Power management – Icc as a function of Pout (typical)-25-20-15-10-50510152025Pout /dBm1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 507090110130Icc / mA150170190-25 -20 -15 -10 -5 0 5 10 15 20 25Pout dBm
Power ManagementnanoPAN 5375 RF Module User Manual (UserMan)Page 8 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.44.5 Icc as a Function of Tx Register (Typical)Figure 8: Power management - Icc as a function of Tx register (typical)050100150200250Icc / mARegister 0x44: TxOutputPower01 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63
Module LayoutnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 955 Module Layout5.1 MeasuresFigure 9: nanoPAN 5375 RF Module – measures5.2 Pin LayoutFigure 10: nanoPAN 5375 RF Module – pins (bottom view)Figure 11: nanoPAN 5375 RF Module – pin layout (bottom view)Note: See section 5.3: Pin Description on page 10 for details on the nanoPAN 5375 RF Module pinning.15.029.0 3.8Unit = mmScale 3:1Scale 3:1Pin 1Pin 3217 18 19 20 21GNDGNDGNDVCCGND22 23 24 25 26GNDGNDANTGND/TX_/RX54321SPICLKGNDGNDVCC10 9 8 7 6DIIO2DIIO3SPITXDUCVCCSPIRXDGND16GND15GND14/PONRESET13DIIO012DIIO111GND27GND28GND29UCIRQ30UCRESET31/SPISSN32Scale 3:1GND
Module LayoutnanoPAN 5375 RF Module User Manual (UserMan)Page 10 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.55.3 Pin DescriptionTable 8: nanoPAN 5375 RF Module – pin descriptionPin Signal Description Direction1GND Ground connection (0Vdc) –2VCC Positive supply voltage Power3GND Ground connection (0Vdc) –4GND Ground connection (0Vdc) –5SPICLK SPI: CLK3Input6UCVCC11. Should have a pull-down of between 100 kΩ and 1 MΩ if power-down mode is used. Power Supply for µc Output7SPITXD22. SPITXD is SPI data output from the module to the microcontroller. This pin is open-drain as default. This pin must have a pull-up to Vcc because the pin is driven only when a logical 0 is sent from nanoLOC to the SPI marker. Reconnected value: 100 kΩ. This pin can be programmed as push-pull output. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide and the nano-LOC SPI Application Note.) SPI: TX Transmit Data (MISO)33. nanoLOC TRX is always a SPI slave device.Output8SPIRXD SPI: RX Receive Data (MOSI)3Input9DIIO344. This pin should have a Pull-Down to GND, if not used. Recommended value: 1 MΩ.Digital IO pin 3 for nanoLOC chip Input/Output10 DIIO24Digital IO pin 2 for nanoLOC chip Input/Output11 DIIO14Digital IO pin 1 for nanoLOC chip Input/Output12 DIIO04Digital IO pin 0 for nanoLOC chip Input/Output13 /PONRESET Power on reset signal Input14 GND Ground connection (0Vdc) –15 GND Ground connection (0Vdc) –16 GND Ground connection (0Vdc) –17 GND Ground connection (0Vdc) –18 GND Ground connection (0Vdc) –19 GND Ground connection (0Vdc) –20 GND Ground connection (0Vdc) –21 VCC internally connected to VCC (Pin 2) Power22 GND Ground connection (0Vdc) –23 GND Ground connection (0Vdc) –24 ANT 50 Ohm RX/TX connection to antenna Input / Output25 GND Ground connection (0Vdc) –26 /TX_RX55. /TX_RX is Open-Drain output. It must have a Pull-Up to UCVCC if used. Imax: 2mA.Status Tx / Rx66. Should be used as input signal to a logical input.Output27 GND Ground connection (0Vdc) –28 GND Ground connection (0Vdc) –29 GND Ground connection (0Vdc) –30 UCIRQ77. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 MΩ. Default is Open-Drain. and can be programmed as Push-Pull. (For more details, see the nanoLOC TRX Transceiver (NATR1) User Guide.)Interrupt request for µc Output31 UCRESET88. This pin should have a pull-up of 75 KΩ and a capacitor of 1 nF to GND if used as controller input signal.Reset for µc Output32 /SPISSN99. This pin should have a Pull-Up to Vcc if used. Recommended value: 1 MΩ.SPI: Slave Select Input
Soldering InformationnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1166 Soldering Information6.1 Recommended Temperature Profile for Lead Free Reflow SolderingFigure 12: Recommended temperature profile for reflow soldering (J-STD-020C)6.2 Footprint and Recommended Landing PatternThe same dimensions for the solder paste screen are recommended, depending on the solderscreen thickness.Figure 13: nanoPAN 5375 RF Module footprint – pad configuration (top view)29.028.815 14.8 9.47.8 7.88.41.42.7 0.1 0.2 1.4 1.61.51.6Pin 1 Pin 32 Pin 10nanoPAN5375 RF Module
Soldering InformationnanoPAN 5375 RF Module User Manual (UserMan)Page 12 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.6Figure 14: nanoPAN 5375 RF Module – landing pattern1 Details of the landing pattern are dependent on the technology and should be defined by theassembler. 2 For manual setting of the module, it is recommended to use the corner or side marker in the toplayer (copper) or stop mask.3 For automatic assembly use pattern marker of the carrier board.29.6015.72.7 0.60 1.00 1.601.90Pin 1Pin 32 Pin 101.6
PCB LayoutnanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1377 PCB LayoutFigure 15: nanoPAN 5375 RF Module – top sideFigure 16: nanoPAN 5375 RF Module – bottom side (inverted)Figure 17: nanoPAN 5375 RF Module – components top sideScale 3:1Scale 3:1Scale 3:1
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nanoPAN 5375 RF Test ModulenanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1588 nanoPAN 5375 RF Test Module8.1 OverviewThe nanoPAN 5375 RF Test Module was designed for testing and measurement purposes only. Itwas used during measurements and simulations to determine parameters published in this docu-ment, unless otherwise specified. For conducting tests purposes, the nanoPAN 5375 RF Test Mod-ule includes a 50 Ω coaxial SMA connector.Figure 18: nanoPAN 5375 RF Test Module8.2 PCB LayoutFigure 19: nanoPAN 5375 RF Test Module – top layer
nanoPAN 5375 RF Test ModulenanoPAN 5375 RF Module User Manual (UserMan)Page 16 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.8Figure 20: nanoPAN 5375 RF Test Module – bottom layer (inverted)Figure 21: nanoPAN 5375 RF Test Module – measuresScale = 2:12.4 GHz antennaSMA connector38.5Unit = mmScale 1:138.5
Revision HistorynanoPAN 5375 RF Module User Manual (UserMan)© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 17Revision HistoryVersion Date Description/Changes1.0 2009-03-18 Initial version.
About Nanotron Technologies GmbHnanoPAN 5375 RF Module User Manual (UserMan)Page 18 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.About Nanotron Technologies GmbHNanotron Technologies GmbH develops world-class wireless products for demanding applications based on its patented Chirp transmission system - an innovation that guarantees high robustness, optimal use of the available bandwidth, and low energy consumption. Since the beginning of 2005, Nanotron's Chirp technol-ogy has been a part of the IEEE 802.15.4a draft standard for wireless PANs which require extremely robust communication and low power consumption. ICs and RF modules include nanoNET TRX Transceiver, nanoLOC TRX Transceiver, and ready-to-use or custom wireless solutions. These include, but are not limited to, industrial monitoring and control applica-tions, medical applications (Active RFID), security applications, and Real Time Location Systems (RTLS). nanoNET and nanoLOC are certified in Europe, United States, and Japan and supplied to customers world-wide.Headquartered in Berlin, Germany, Nanotron Technologies GmbH was founded in 1991 and is an active member of IEEE and the ZigBee alliance. Further InformationFor more information about this product and other products from Nanotron Technologies, contact a sales representative at the following address:Nanotron Technologies GmbH Alt-Moabit 60 10555 Berlin, Germany Phone: +49 30 399 954 - 0 Fax: +49 30 399 954 - 188 Email: sales@nanotron.com Internet: www.nanotron.com

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